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Common Failure Modes in DRAM Testing

In the world of semiconductors the pursuits for smaller and faster components is never ending. As the technology races forward, the testing requirements become more complex and demanding. Generally, there can be many types of failures and causes; circuit board related failures, components level faults, and problems associated with the surface mount technology, or actual production itself. Other problems include ESD, life cycle and accelerated aging. Although not comprehensive in nature, this list serves as a introductory overview regarding the most common failure modes associated with DRAMs.

AVL supports a suite of comprehensive testing protocols and procedures. The validation process is designed to flag failing units as "non-conforming" and results in a "no pass" status.

  • Open or short circuits
  • "Stuck at" failures
  • Adjacent cell intrusion or disturbance
  • Leakage
  • Access times-min/max to specification
  • Read / write recovery
  • Continuity
  • Input / output levels violate specification
  • Active and standby power
  • Refresh times out of compliance
  • Noise or cross talk

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